DEEPX and Hyundai Motor Group Robotics LAB Partner to Develop Next-Generation Physical AI Compute Platform for Robotics
This image was generated by AI and may not depict real events.
DEEPX and Hyundai Motor Group's Robotics LAB are collaborating to develop a next-generation Physical AI computing platform for advanced robotics. The partnership aims to enable robots to perceive their surroundings and make autonomous decisions using ultra-low-power AI semiconductor technology.
DEEPX and Hyundai Motor Group's Robotics LAB have announced a strategic collaboration to develop a next-generation Physical AI computing platform for advanced robotics. The partnership focuses on Vision-Language-Action and Vision-Language Model technologies to enable robots to perceive their surroundings and make autonomous decisions. The collaboration will cover four key areas: ultra-low-power AI semiconductor architecture, AI computing hardware systems, Physical AI software stack, and robotics application AI libraries. DEEPX's DX-M2 chip is central to this collaboration, designed to run large-scale AI models in ultra-low-power environments. The Physical AI semiconductor market is projected to reach $123 billion by 2030, driven by robotics and humanoids. The companies have been jointly developing low-power 'edge brain' technology for robotics over the past three years.
This content was automatically generated and/or translated by AI. It may contain inaccuracies. Please refer to the original sources for verification.