Australia's Syenta raises US$26 million to ease AI chip bottleneck
Australian startup Syenta has raised $26 million to develop a new manufacturing technique for AI chip packaging, aiming to ease supply chain bottlenecks. The company plans to open an office in Arizona and target high-volume production by 2028.
Syenta, an Australian semiconductor technology startup, has raised $26 million to develop a new manufacturing technique for AI chip packaging. The funding round was led by Playground Global, a Silicon Valley firm, with participation from Australia's National Reconstruction Fund and other investors. Syenta's technology aims to simplify the production of base layers for AI chips, reducing the number of steps by 40%. The company plans to open an office in Arizona, near Intel and TSMC's manufacturing facilities, and target high-volume production by 2028. Former Intel CEO Pat Gelsinger will join Syenta's board of directors. Syenta is working with several chip designers to implement its technology.
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