Huawei touts new chipmaking technology to sidestep US restrictions

Huawei’s semiconductor division revealed a breakthrough in chipmaking technology on Monday, introducing a method to bypass US export restrictions that have limited access to advanced lithography machines. The company’s head of semiconductors, He Tingbo, announced plans to produce next-generation 1.4-nanometer (1.4nm) chips by 2031, a process currently dominated by Taiwan’s TSMC, which expects to achieve the same by 2028. The new technique, dubbed 'Tau Scaling Law' or 'Her's Law,' shifts chip design away from traditional transistor density optimizations outlined by Moore’s Law. Instead, it prioritizes reducing the time for chip components to communicate, addressing a key bottleneck in miniaturization. Huawei claims this approach avoids reliance on extreme ultraviolet (EUV) lithography machines, which US sanctions have blocked the company from acquiring. Huawei’s next Kirin chip series, launching in autumn, will be the first to fully integrate 'LogicFolding' architecture, based on the new principle. The company asserts its chips will match the performance of competitors while offering a cost-effective alternative. Analysts suggest the move underscores Huawei’s ambition to lead in semiconductor innovation, potentially escalating tensions with the US over technology access. US restrictions, imposed since 2019, have already hindered Huawei’s ability to source components and advanced manufacturing tools. The company’s persistence in developing alternatives reflects its strategy to circumvent sanctions while maintaining its position in the global tech race. Industry observers note that even without immediate product launches, Huawei’s long-term trajectory signals a direct challenge to US-led supply chain dominance.