India gets first advanced 3D chip packaging plant, Intel helping it set up in Odisha
India has laid the foundation for its first advanced 3D chip packaging plant in Odisha, backed by global players like Intel, to boost its domestic semiconductor ecosystem. The facility will focus on next-gen chip packaging for AI, telecom, and defence sectors, with commercial production expected to begin by August 2028.
India has established its first advanced 3D chip packaging plant in Odisha, a significant step in developing its domestic semiconductor ecosystem. The facility, set up by US-based 3D Glass Solutions, will focus on advanced packaging for AI, telecom, and defence sectors. Intel is supporting the initiative, highlighting growing international interest in India's semiconductor plans. The project, worth nearly Rs 2,000 crore, is expected to produce 70,000 glass panels annually and create around 2,500 jobs. Commercial production is slated to begin by August 2028, with full-scale operations targeted by 2030. This development is part of the India Semiconductor Mission, aimed at expanding the country's semiconductor ecosystem.
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