Intel, 3DGS to set up $3.3 billion substrate plant in Odisha
Intel and 3DGS Inc. will invest $3.3 billion to build a substrate manufacturing plant in Odisha, India, creating over 1,800 high-skilled jobs as part of India’s push for local semiconductor production. The facility, spanning five to six years, will produce advanced packaging materials like glass core substrates and high-density interconnects in the Bhubaneswar-Khurda region.
Intel and 3DGS Inc. are establishing a $3.3 billion substrate manufacturing plant in Odisha, India, marking a major step in the country’s semiconductor expansion. The project, announced by the Indian government, will focus on producing advanced packaging materials—including glass core substrates and high-density interconnects—over five to six years in the Bhubaneswar-Khurda region. Substrates serve as the foundational material for semiconductor devices, supporting critical components like chips. The plant is expected to generate over 1,800 direct high-skilled jobs, aligning with India’s broader strategy to boost local production under Prime Minister Narendra Modi’s leadership. India has committed billions in subsidies to attract semiconductor manufacturing, reflecting its ambition to reduce reliance on imports. The Odisha facility will contribute to this goal by supplying essential materials for advanced packaging, a key segment of the global chip industry. Construction will unfold in phases, with the plant’s development tied to India’s growing tech infrastructure. The investment underscores the collaboration between US firms and India’s push for self-sufficiency in high-tech manufacturing.
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