Samsung ships HBM4E chip samples to global customers
Samsung Electronics began shipping samples of its 12-layer HBM4E chip, the first next-generation AI memory product globally, offering speeds up to 16 gigabits per second per pin. The company, which previously mass-produced HBM4 chips in February, plans to ramp up HBM4E production for major AI customers including AMD, Nvidia, and Google.
Samsung Electronics announced it has started shipping sample units of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the first global shipment of this next-generation AI memory solution. The move follows Samsung’s February launch of mass production for its sixth-generation HBM4 chips, reinforcing its dominance in the AI memory market. The HBM4E chip delivers industry-leading performance through optimized design and manufacturing, achieving data transfer speeds of up to 16 gigabits per second per pin—over 20% faster than the previous HBM4 lineup. It also supports bandwidth of up to 3.6 terabytes per second per stack, accelerating processing for large language models and advanced AI systems. Samsung confirmed the HBM4E samples were shipped without disruption, further solidifying its technological leadership in AI memory. Head of memory development Hwang Sang-joon stated in a press release that the company will begin mass production of HBM4E in line with customer schedules. Key customers for the HBM4E include major AI firms such as Advanced Micro Devices (AMD), Nvidia, and Google. Samsung’s rapid iteration from HBM4 to HBM4E underscores its commitment to meeting growing demand for high-performance memory in AI applications.
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