Siemens collaborates with TSMC to advance AI for semiconductor design
Siemens and TSMC are collaborating to advance AI-powered automation in semiconductor design, expanding support across the EDA workflow. Siemens' Calibre and Aprisa software are being used to enhance productivity in custom IC design and accelerate digital design cycles.
Siemens is collaborating with TSMC to drive innovation in AI-powered automation and advanced semiconductor design. The partnership is expanding support across the EDA workflow, including automated fixing of design rule violations and certified solutions for leading-edge process technologies. Siemens' Fuse EDA AI System is being used to advance AI-powered automation across EDA workflows. TSMC is working with Siemens to enhance productivity in custom IC design using Calibre software and accelerate digital design cycles with Aprisa software. Siemens' Calibre nmPlatform software has achieved certification for TSMC's 3nm, 2nm, A16, and A14 process technologies. The collaboration is enabling customers to create and reliably verify analog, mixed-signal, RF, standard cell, and memory designs using advanced TSMC nodes.
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