SK hynix unveils 'iHBM' thermal solution to boost AI performance

SK hynix introduced the iHBM solution, a thermal management system designed to improve AI performance by integrating cooling elements into high-bandwidth memory (HBM) packages. The solution embeds ICEs—silicon-based, thermally conductive materials—directly into HBM packages, reducing thermal resistance by 30% and ensuring stable operation in high-temperature and high-pressure conditions. The iHBM addresses power density challenges in the Die-to-Die Physical Layer (D2D PHY), the interface connecting HBM and GPUs, which is critical for next-generation AI systems. SK hynix’s wafer-level packaging (WLP) process, built on its market-proven Mass Reflow Molded Underfill (MR-MUF) technology, enables high-volume production while maintaining compatibility with existing System-in-Package (SiP) architectures. This minimizes design adjustments for customers adopting the new technology. The company’s mass-production capabilities further strengthen its position in the AI memory market. By combining advanced packaging technology with memory design expertise, SK hynix aims to lead in AI memory solutions. Kangwook Lee, Senior Vice President and Head of PKG Development, stated that iHBM provides the thermal management needed for AI environments, reinforcing the company’s leadership in AI memory. SK hynix, headquartered in South Korea, is a global leader in DRAM and NAND flash memory chips, serving customers worldwide. The iHBM solution aligns with its strategy to preemptively address AI industry demands, ensuring stable and efficient chip performance for high-performance computing applications.