VinRobotics and Infineon sign MoU to advance core technologies for next-generation robotics
VinRobotics, Vietnam’s robotics company under Vingroup, signed a Memorandum of Understanding (MoU) with Infineon Technologies to collaborate on next-generation robotics using advanced semiconductor tech. The partnership will establish the VinRobotics-Infineon Competency Center (VRICC) for joint R&D, training, and early-stage project involvement, aiming to develop humanoid robots for industrial, service, and home applications.
VinRobotics, the robotics arm of Vietnam’s Vingroup, has signed a Memorandum of Understanding (MoU) with Infineon Technologies AG to advance next-generation robotics through semiconductor innovation. Announced on June 9, 2026, the collaboration aims to integrate Infineon’s expertise in power systems and IoT with VinRobotics’ robotics platforms, reinforcing Vietnam’s role in global tech partnerships. The partnership will establish the VinRobotics-Infineon Competency Center (VRICC) at VinRobotics’ facilities, fostering technical exchange and co-innovation. Infineon will contribute semiconductor solutions, training for VinRobotics’ R&D teams, and early-stage project support, while both companies will identify joint development opportunities. Infineon’s focus includes enabling efficient power flow, balanced movement, and safety compliance for robots, supporting VinRobotics’ goal of scaling humanoid robots across industries like manufacturing, services, and home automation. The collaboration aligns with VinRobotics’ strategy to build core tech capabilities and expand into international markets. Founded in November 2024, VinRobotics is Vietnam’s pioneer in robotics, targeting next-gen platforms for industrial and daily-life applications. CEO Ngo Quoc Hung emphasized the partnership’s role in leveraging Infineon’s global expertise to develop locally driven, globally competitive robotics solutions. Infineon’s Chief Sales Officer, Philipp von Schiersteadt, highlighted the collaboration’s potential to accelerate humanoid robot deployment, addressing critical challenges like power efficiency, dexterity, and safety. The partnership underscores both companies’ commitment to advancing robotics through semiconductor innovation and cross-industry applications.
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